| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition sufficiently excellent in all of adhesion property, high-temperature adhesiveness, pattern forming property, thermo-compression bonding property, heat resistance, and moisture resistance; and to provide a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the photosensitive adhesive composition. <P>SOLUTION: The photosensitive adhesive composition comprises a resin (A) having a film formation ability, a compound (B) having an ethylenically unsaturated group and an epoxy group, and a photoinitiator (C). <P>COPYRIGHT: (C)2011,JPO&INPIT |
