| 主权项 |
1. An integrated electronics module comprising
a substrate, electronics components mounted on a mount-surface of the substrate, a heat-conducting layer disposed on a cooling-surface of the substrate, the cooling-surface and the mount-surface being on opposite sides of the substrate, a fluid-cooling structure of non-magnetic material and having a fluid conduit mounted in thermal contact with the heat-conducting layer which is formed as a slotted copper layer. |
