发明名称 |
METHODS OF TRANSFERRING ELECTRICALLY CONDUCTIVE MATERIALS |
摘要 |
Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200°F to 450°F, and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed. |
申请公布号 |
WO2015066462(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
WO2014US63406 |
申请日期 |
2014.10.31 |
申请人 |
PPG INDUSTRIES OHIO, INC.;SI-CAL TECHNOLOGIES, INC., A NISSHA COMPANY |
发明人 |
TYLER, JAYE;CHEETHAM, PAUL F.;BURN, DARREN;MCCOLLUM, GREGORY J. |
分类号 |
H05K3/20;H05K1/09;H05K1/16;H05K3/38 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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