| 摘要 |
<p>The present invention provides a vacuum deposition apparatus, which belongs to the field of vacuum deposition, and can solve a problem of uneven thickness of a coating formed by using an existing vacuum deposition apparatus. The vacuum deposition apparatus of the present invention comprises a deposition chamber, at least one evaporation source apparatus provided inside the deposition chamber, and a baffle component provided between the evaporation source apparatus and a substrate for deposition, the evaporation source apparatus being provided at a central region of a bottom plate of the deposition chamber; the baffle component having a baffle component opening whose position corresponds to that of the evaporation source apparatus and is for a deposition substance to pass through. Because an evaporation source apparatus is provided at a central region of a deposition chamber, the thickness of a coating formed on a surface of a substrate becomes more even.</p> |
