发明名称 可溶性ポリイミドおよびその製造方法、ワニス並びにポリイミドフィルム
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a soluble polyimide which exhibits solubility to organic solvent and has high mechanical strength as well as excellent heat resistance and light transmissibility, a method for producing the same, a vanish and a polyimide film. <P>SOLUTION: The soluble polyimide includes: (1) 1-80 mol% of a structural unit in which two imide-aromatic ring condensed rings are connected through one bond selected from the group consisting of ether bond, alkylene group, fluorenylene group, sulfonyl group and ketone bond; and (2) 20-99 mol% of a structural unit in which two imide-aromatic ring condensed rings are connected through carbon-carbon bond. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5712811(B2) 申请公布日期 2015.05.07
申请号 JP20110138070 申请日期 2011.06.22
申请人 发明人
分类号 C08G73/10 主分类号 C08G73/10
代理机构 代理人
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