发明名称 |
METHODS OF FORMING GATE STRUCTURES WITH MULTIPLE WORK FUNCTIONS AND THE RESULTING PRODUCTS |
摘要 |
One illustrative method disclosed herein includes removing sacrificial gate structures for NMOS and PMOS transistors to thereby define NMOS and PMOS gate cavities, forming a high-k gate insulation layer in the NMOS and PMOS gate cavities, forming a lanthanide-based material layer on the high-k gate insulation layer in the NMOS and PMOS gate cavities, performing a heating process to drive material from the lanthanide-based material layer into the high-k gate insulation layer so as to thereby form a lanthanide-containing high-k gate insulation layer in each of the NMOS and PMOS gate cavities, and forming gate electrode structures above the lanthanide-containing high-k gate insulation layer in the NMOS and PMOS gate cavities. |
申请公布号 |
US2015126023(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
US201314069782 |
申请日期 |
2013.11.01 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Choi Kisik;Kim Hoon |
分类号 |
H01L21/28;H01L29/51 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming replacement gate structures for an NMOS transistor and a PMOS transistor, comprising:
performing at least one etching process to remove a sacrificial gate structure for said NMOS transistor and a sacrificial gate structure for said PMOS transistor to thereby define an NMOS gate cavity and a PMOS gate cavity; depositing a high-k gate insulation layer in said NMOS gate cavity and in said PMOS gate cavity; prior to performing any heating processes on said as-deposited high-k gate insulation layer in either of said NMOS or PMOS gate cavities, performing a deposition process to deposit a lanthanide-based material layer on said as-deposited high-k gate insulation layer that is positioned within said NMOS and PMOS gate cavities, wherein said as-deposited lanthanide-based material layer comprises lanthanum; after depositing said lanthanide-based material layer, performing at least one heating process to drive material from said as-deposited lanthanide-based material layer into said as-deposited high-k gate insulation layer so as to thereby form a lanthanide-containing high-k gate insulation layer in each of said NMOS and PMOS gate cavities; and performing at least one process operation to form a first gate electrode structure above said lanthanide-containing high-k gate insulation layer in said NMOS gate cavity and a second gate electrode structure above said lanthanide-containing high-k gate insulation layer in said PMOS gate cavity. |
地址 |
Grand Cayman KY |