发明名称 |
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS |
摘要 |
A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer. |
申请公布号 |
US2015126026(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
US201514589748 |
申请日期 |
2015.01.05 |
申请人 |
Tyco Electronics Corporation ;Tyco Electronics Services GmbH |
发明人 |
Sachs Soenke;Schmidt Helge;Leidner Michael;Henschel Eva;Freckmann Dominique;Myers Marjorie |
分类号 |
H01L21/768;H01L23/34 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing an electrical component, the method comprising:
providing a substrate; applying an insulating layer on the substrate; applying a circuit layer on the insulating layer; irradiating the insulating layer with an electron beam to transform the insulating layer; and irradiating the circuit layer with an electron beam to transform the circuit layer. |
地址 |
Berwyn PA US |