| 摘要 |
The purpose of the present invention is to improve cooling capability of a semiconductor module that uses pin connections. A semiconductor module is provided with: pins (4) connected to a semiconductor element (1); a pin wiring board (5) which is provided with a second metal foil (5c) and first metal foil (5b) on the upper and lower surfaces thereof, and in which the first metal foil (5b), the second metal foil (5c), and the pins (4) are electrically bonded; solder (3c) which bonds the pins (4) to the semiconductor element (1); a DCB substrate (2) which is provided with a third metal foil (2b) and fourth metal foil (2c) on the upper and lower surfaces thereof, and in which the third metal foil (2b) is bonded with the lower surface of the semiconductor element (1); and a first cooler (6) which is connected to the fourth metal foil (2c). For the semiconductor module, H/T, which is the ratio of the height H of the solder to the distance T from the semiconductor element (1) to the first metal foil (5b), is in the range of 0.2-0.7. |
