发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INSULATING PART
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming an insulating part, from which an insulating part having excellent chemical resistance and adhesiveness to a substrate and good deforming property into a desired shape by a low-temperature heat treatment can be formed, and to provide a production method of a substrate having a patterned insulating part by using the photosensitive resin composition, a substrate having a patterned insulating part produced by the method, and a capacitance type touch panel manufactured by using the substrate.SOLUTION: The photosensitive resin composition is to be used for forming an insulating part in a touch panel having a specific structure; and the composition comprises a copolymer having a unit expressed by formula (1) and a unit expressed by formula (2), a photosensitive agent, and a solvent.
申请公布号 JP2015087818(A) 申请公布日期 2015.05.07
申请号 JP20130223585 申请日期 2013.10.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MATSUMOTO NAOZUMI;INOUE TOMOYUKI;YAMAGUCHI TOSHIHIRO
分类号 G06F3/041;B32B9/00;C08F220/30;C08F220/32;G03F7/004;G03F7/023;G03F7/09;G06F3/044;H01B3/40;H01B3/44;H01L21/027 主分类号 G06F3/041
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