| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin composition having a melting temperature suitable for molding, a resin sheet containing the resin composition, a resin cured product and a substrate excellent in thermal conductivity and heat resistance.SOLUTION: A resin composition containing an epoxy compound and a curing agent selected from 1,3,5-tris(4-aminophenyl)benzene and 1,3,5-tris(4-hydroxyphenyl)benzene is prepared so that the content percentage of 1,3,5-tris phenylbenzene which is a main skeleton of the curing agent is 15 mass% to 50 mass% in the total organic product in the resin composition.</p> |
