FIXING DEVICE AND IMAGE FORMING APPARATUS

摘要

A fixing device includes a fixing rotator, a nip formation pad disposed opposite an inner circumferential surface of the fixing rotator, and a pressure rotator pressed against the nip formation pad via the fixing rotator to form a fixing nip between the fixing rotator and the pressure rotator, through which a recording medium is conveyed. A support is disposed opposite the pressure rotator via the nip formation pad to support the nip formation pad against pressure from the pressure rotator. The nip formation pad conducts heat in a thickness direction thereof perpendicular to an axial direction of the fixing rotator and a recording medium conveyance direction. The nip formation pad includes a multi-conductivity layer having a thermal conductivity varying in the axial direction of the fixing rotator and a support side layer contacting the support and having a thermal conductivity greater than a thermal conductivity of the support.

主权项

1. A fixing device comprising:
a fixing rotator rotatable in a predetermined direction of rotation; a heater disposed opposite the fixing rotator to heat the fixing rotator; a nip formation pad disposed opposite an inner circumferential surface of the fixing rotator; a pressure rotator pressed against the nip formation pad via the fixing rotator to form a fixing nip between the fixing rotator and the pressure rotator, the fixing nip through which a recording medium is conveyed; and a support disposed opposite the pressure rotator via the nip formation pad to support the nip formation pad against pressure from the pressure rotator, the nip formation pad to conduct heat in a thickness direction thereof perpendicular to an axial direction of the fixing rotator and a recording medium conveyance direction, the nip formation pad including:
a multi-conductivity layer having a thermal conductivity varying in the axial direction of the fixing rotator; anda support side layer contacting the support and having a thermal conductivity greater than a thermal conductivity of the support.