| 发明名称 |
COMPOSITE MODULE |
| 摘要 |
A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a. |
| 申请公布号 |
US2015124409(A1) |
申请公布日期 |
2015.05.07 |
| 申请号 |
US201414541286 |
申请日期 |
2014.11.14 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Kawano Koji;Enkyo Naofumi;Kato Koki |
| 分类号 |
H05K7/20;H05K7/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composite module comprising:
a first substrate; and an external connector mounted on one principal surface of the first substrate, wherein an electronic component device is disposed in a region of another principal surface of the first substrate opposed to the external connector across the first substrate sandwiched between the stated region and the external connector. |
| 地址 |
Kyoto JP |
