发明名称 RUGGEDIZED COMPUTER AND ASPECTS THEREOF
摘要 A ruggedized computer, having a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from the interior surface of the metal case. Also, a slide plate is supported within the metal case and is in thermal contact to the thermal mass; and a delicate, heat-producing integrated circuit, having a planar surface, is supported in the computer, with the planar surface being in thermal contact to the slide plate. Finally, the slide plate is held in place by a resilient system that permits, but gently resists, movement perpendicular to the integrated circuit, which is thereby not damaged due to force applied from the thermal mass through the slide plate to the integrated circuit, but whereby the thermal mass enhances thermal stability of the integrated circuit.
申请公布号 US2015124394(A1) 申请公布日期 2015.05.07
申请号 US201414581692 申请日期 2014.12.23
申请人 Aplus Mobile Inc. 发明人 Faucett Tim;Westfall Scott
分类号 G06F1/20;G06F1/18 主分类号 G06F1/20
代理机构 代理人
主权项 1. A ruggedized computer, comprising: (a) a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from said interior surface of said metal case; (b) a slide plate, supported within said metal case and in thermal contact to said thermal mass; (c) a delicate, heat-producing integrated circuit, having a planar surface, and supported in said computer, said planar surface being in thermal contact to said slide plate; and (d) wherein said slide plate is held in place by a resilient system that permits, but gently resists, movement perpendicular to said integrated circuit, which is thereby not damaged due to force applied from said thermal mass through said slide plate to said integrated circuit, but whereby said thermal mass enhances thermal stability of said integrated circuit.
地址 Oregon City OR US