发明名称 CIRCUIT SUBSTRATE, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC DEVICE
摘要 This circuit substrate (10) is provided with a plate body (1) comprising a dielectric body and having a front surface and a back surface, a differential signal line (4) which comprises a pair of signal lines (2, 3) formed on the front surface, and a ground conductor (5) formed on the back surface. The signal lines (2, 3) have: terminals (2b, 3b) which are formed at a distance from the ground conductor (5), in an end portion a prescribed distance (1b) away from one end (1a) of the back surface; connection pads (2c, 3c) connected to said terminals (2b, 3b) and provided on the end portion of the front surface and opposite of the terminals (2b, 3b); transmission line units (2a, 3a) which extend from the connection pads (2c, 3c); and a widened portion (2d) the line width of which has been increased, and which is provided in a position corresponding to the interval between the ground conductor (5) and the terminal (2b) of the transmission line units (2a, 3a). By means of the terminal (2b), it is possible to achieve a circuit substrate (10) which has a connection terminal (2b) on the back surface of the circuit substrate (10) and which has excellent high-frequency characteristics.
申请公布号 WO2015064637(A1) 申请公布日期 2015.05.07
申请号 WO2014JP78756 申请日期 2014.10.29
申请人 KYOCERA CORPORATION 发明人 KAWAZU, YOSHIKI
分类号 H05K1/11;H01P3/04;H05K1/02;H05K1/14 主分类号 H05K1/11
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