| 摘要 |
PROBLEM TO BE SOLVED: To provide a spherical silica fine powder which allows high filling in a resin composition for semiconductor sealing and does not impair flowability of the resin and its production method.SOLUTION: A spherical silica fine powder has a maximum value of the particle size distribution in the range of particle sizes of 1-10 μm and meets requirements (1) to (3): (1) the amount of coarse particle residue on a sieve of the sieve opening of 45 μm is 0.01 wt.% or smaller; (2) the gradient n of the particle size distribution shown in Rosin-Rammler distribution chart is 1.9-3.6; and (3) the total content of Fe and Al by ICP emission spectrochemical analysis is 15 ppmW or lower. |
