发明名称 LASER CUTTING METHOD AND MATERIAL TO BE CUT
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting method by which a thin work-piece can be easily processed with laser beam, and a material to be cut which is used in the laser cutting method.SOLUTION: A laser cutting method for a thin plate-like work-piece, in which the work-piece W is stuck to a sheet member 1 which laser beam can freely penetrate and which cannot be cut with laser beam, the sheet member 1 is placed on plural work-piece support members which are provided on a work-table or a work-palette in a laser cutting machine, and the work-piece W is irradiated with laser beam, whereby laser cutting work is carried out. A material to be cut, which is used in the laser cutting method, is prepared in such a manner that the thin-plate like work-piece W is stuck to the sheet member 1 which laser beam can freely penetrate and which cannot be cut with laser beam, and the sheet member 1 is so configured to be thicker than the work-piece W.
申请公布号 JP2015085355(A) 申请公布日期 2015.05.07
申请号 JP20130226151 申请日期 2013.10.31
申请人 AMADA CO LTD 发明人 YAMANASHI TAKAAKI
分类号 B23K26/38;B23K26/60;B23K26/70 主分类号 B23K26/38
代理机构 代理人
主权项
地址