| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and avoidance method, capable of avoiding generation of an undesired power voltage drop in a region where a feeding pad cannot be disposed.SOLUTION: The semiconductor integrated circuit device, such as BGA in which semiconductor chips 2 are mounted on a first interposer, such as a multi-layer organic wiring substrate 1, in a face-up manner, is configured so that a first metal through electrode group 31 which is mounted on the semiconductor chips 2 and supplies a power supply potential to a core circuit and a first metal land 21 on the interposer are interconnected through a first conductive adhesive member membrane 41. |
