| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology capable of simplifying a process and securing a misalignment margin when bonding two wafers to manufacture an image sensor using backside illumination photodiodes.SOLUTION: When manufacturing an image sensor through a 3D CIS manufacturing process, two wafers, that is, a first wafer and a second wafer, are electrically connected using vias of one of the two wafers and bonding pads of the other wafer. In addition, when manufacturing an image sensor through the 3D CIS manufacturing process, two wafers are electrically connected using vias of the two wafers.</p> |
