| 摘要 |
<p>A resin composition which comprises (A) a phosphine oxide represented by general formula (1) and (B) a polyamide or polyimide compound obtained by reacting a diamine with a tetrabasic acid dianhydride; and a photosensitive resin composition which comprises the components (A) and (B), and (C) a photosensitizer or (D) a photopolymerization initiator. Cured films made from the compositions exhibit excellent flame retardance, heat resistance, moisture resistance and electrical insulation properties.</p> |
