ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS

摘要

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

主权项

1. An electronic module, comprising:
a substrate comprising a component portion wherein the component portion includes a component area on a surface of the substrate, and a plurality of metallic layers extending along a periphery of the component portion and the plurality of metallic layers being coupled to one another; an electronic component on the component area; an overmold formed over the component area; and an electromagnetic shield formed over the overmold and covering the component area, the electromagnetic shield being coupled along the periphery of the component portion to at least a first metallic layer in the plurality of metallic layers.