| 摘要 |
A coater and developer that is linked to a stepper for operation during production of an integrated circuit, and specifically a processing modular structure and a layout method of a coater and developer, comprising: a centrifugal processing process module and a thermal processing process module, multiple centrifugal processing process modules being stacked to form a centrifugal processing process group having stack layers, multiple thermal processing process modules being stacked to form a thermal processing process group having stack layers, and the thermal processing process modular structure having double channels. Both a coating station and a development station are provided with the centrifugal processing process group and the thermal processing process group, multiple centrifugal processing process groups are arranged in parallel horizontally, multiple thermal processing process groups are arranged in parallel longitudinally, the process groups in the coating station and the development station are arranged in an inverted C layout, and a wafer transfer robot is placed at the center of the inverted C layout. The processing module has reasonable arrangement, the platform has a compact structure and covers a small area, the internal processing modules are interchangeable, and the processing adaptability of the machine is expanded. |
