FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR SEMICONDUCTOR DEVICE PRODUCTION

摘要

The present invention relates to a film for manufacturing a semiconductor device comprising: a separator; and a plurality of adhesive layer-attached dicing tapes including a dicing tape and adhesive layers stacked on top of the dicing tape, wherein the adhesive layers are stacked at regular intervals on top of the separator in the way of the adhesive layers adhering to the separator. The separator has a cutting part formed along the outer circumference of the dicing tape, wherein the depth of the cutting part is two-thirds or smaller of the thickness of the separator.