METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element, capable of suppressing a metal film from unintentionally remaining at a boundary portion in a step.SOLUTION: A method for manufacturing a semiconductor element includes the following steps in the order: a step of forming a first resist film; a step of exposing a region excluding at least a boundary portion of a step in the first resist film to increase the solubility in an exposed region; a step of removing the first resist film formed in the exposed region; a step of forming a second resist film; a step of exposing a region including a region where at least the first resist film is formed in the second resist film to increase the solubility in an exposed region; a step of decreasing the solubility in the exposed region in the second resist film, and then increasing the solubility in a region other than the region having been decreased in solubility; a step of removing the second resist film formed in the region having been increased in solubility; a step of forming a metal film; and a step of removing the metal film formed on the top surface of the second resist film together with the first resist film and the second resist film.