| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of easily leading out a front wiring from an arbitrary pad without bringing it into contact with the other pad when mounted on a wiring board.SOLUTION: A sealing body 12 covers a chip 12. External connection terminals 13 are connected to the chip 11 and exposed from one surface of the sealing body 12. On the one surface of the sealing body 12, a plurality of external connection terminals are provided so as to be arranged in a lattice shape. On the one surface of the sealing body 12, in a view of one of the external connection terminals 13 out of all the external connection terminals 13, the others of the external connection terminals 13 are arranged in a predetermined range of at least one direction out of 8 directions defined as the horizontal column direction of lattices, the vertical column direction thereof and directions between the horizontal column direction and the vertical column direction. |
