| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device for processing a substrate, capable of further suppressing corrosion or oxidation of a metal wire exposed on a substrate surface.SOLUTION: The present invention relates to a substrate processing device 1 having a processing chamber 2 in which a substrate W is disposed and to which a substrate processing liquid for processing the substrate W is supplied. The device includes: an inert gas filling mechanism (18, 39, 41) for filling with inert gas the interior of the processing chamber 2 in which the substrate W is disposed; and a catalytic unit 21 installed near or inside the processing chamber 2, and filled with a platinum-group metal catalyst allowing hydrogen-dissolved water to pass therethrough, the hydrogen-dissolved water comprising ultra-pure water added with hydrogen. A hydrogen-dissolved processing liquid is supplied as the substrate processing liquid into the processing chamber 2, the hydrogen-dissolved processing liquid being obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst.</p> |
