SYSTEM AND APPARATUS FOR NETWORK DEVICE HEAT MANAGEMENT

摘要

Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted on the printed circuit board, the connector cage being within a certain distance from the at least one slot in the PCB.

主权项

1. A system for improving heat dissipation in a network device, comprising:
a printed circuit board including at least one slot formed from between edges of multiple projections of the printed circuit board; and a connector cage mounted on at least one of the multiple projections of the printed circuit board using one or more of a plurality of pins associated with the connector cage, whereby the at least one slot being configured to improve heat dissipation in the network device via enabling air circulation between the multiple projections of the printed circuit board.