| 摘要 |
The purpose of the present invention is to provide a semiconductor module which can improve cooling capability in a semiconductor module that uses a pin bonding. A semiconductor module is provided with: a semiconductor element (1); pins (10) that are electrically and thermally connected to the top of the semiconductor element (1); a pin wiring board (5) which is provided with a first metal foil (5b) on the rear face, and a second metal foil (5c) on a front face, respectively, of a pin wiring-use insulating substrate (5a), and wherein the first metal foil (5b) and the pins (10) are bonded; a first DCB substrate (2) which is provided with a third metal foil (2b) on a front face, and a fourth metal foil (2c) on a rear face, respectively, of a first ceramic insulating substrate (2a), and wherein the third metal foil (2b) is bonded to the lower surface of the semiconductor element (1); a first cooler (6) which is thermally connected to the fourth metal foil (2c); and a second cooler (7) which is thermally connected to the second metal foil (5c). |
