发明名称 |
SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF STACKING MEMORY ELEMENTS ON A SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a die coupled to a substrate, a first memory device coupled to a surface of the die opposite the substrate and a coupling device coupled between the surface of the die opposite the substrate and a second memory device such that the second memory device at least partially overlaps the first memory device. Also disclosed is method of mounting first and second memory devices on a die in an at least partially overlapping manner. |
申请公布号 |
WO2014127032(A9) |
申请公布日期 |
2015.05.07 |
申请号 |
WO2014US16081 |
申请日期 |
2014.02.12 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
HENDERSON, BRIAN, M.;GU, SHIQUN |
分类号 |
H01L25/065;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|