| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device having high connection reliability.SOLUTION: The light emitting device includes a substrate 10 having a wiring pattern 11, an anisotropic conductive adhesive 23 disposed on a substrate electrode 12 of the wiring pattern 11, and a light-emitting element 30 mounted on the anisotropic conductive adhesive 23. At least one of the substrate electrode 12 and an element electrode 31 is plated with an AuSn alloy layer. The anisotropic conductive adhesive 23 comprises an epoxy compound, an acid anhydride, white inorganic particles, and conductive particles 8 comprising resin particles coated with an Au coating layer. Even when cracks are generated in a eutectic junction part, electric connection between the substrate electrode 12 and the element electrode 31 can be maintained by the Au coating layers of the conductive particles. |
