PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof which are capable of applying conductive polymer treatment to an insulator layer and a resist to realize a microcircuit, and capable of dispersing external stress on the circuit by rounding corners of the circuit.SOLUTION: A printed circuit board 1000 comprises: an insulator layer 100; and a circuit pattern 203 formed on the insulator layer 100 and having a seed conductive polymer layer 201 and a plating layer 202 formed on the polymer layer 201.