| 摘要 |
<p>Provided is a flexible multilayer substrate that suppresses peeling of surface conductors and resin film, has superior bond strength for the surface conductors and resin film, and suppresses occurrences of shorting defects. In this flexible multilayer substrate (1), peeling between the surface conductors (5) and the resin film (3) is suppressed and shorting defects are also suppressed by making the thickness of a resin film (3) of the outermost layer greater than the thickness of resin films (2) for inside layers and making the surface roughness of the surface of surface conductors (5) formed on the resin film (3) of the outermost layer and in contact with the resin film (3) be greater than the surface roughness of inside conductors (4).</p> |
