| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrochemical device enabling improvement in fixing strength between an electrode pad and a lead, and to provide a circuit board. <P>SOLUTION: A lead 3 of an electrochemical device includes a lead body 3A including Al and a metal thin film 3a which is provided and folded at the tip of the lead body 3A. This metal thin film 3a includes a thin film body 3a1 containing Ni and a plated layer 3a2 which covers at least an external surface of the folded thin film body 3a1 and contains Sn. A specific region on an inner surface of the folded thin film body 3a1 and a lower face of the lead body 3A come into direct contact with and welded to each other in a predetermined region R3L without the intermediary of the plated layer 3a2. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
