SOLDERING DEVICE EQUIPPED WITH DECOMPOSITION MECHANISM, AND DECOMPOSITION METHOD

摘要

Provided are a soldering device and a decomposition method with which formic acid can be processed safely and quickly, corrosion of a vacuum pump does not occur, and the exhaust speed and the degree of vacuum in the vacuum chamber can be ensured. This soldering device is equipped with a decomposition mechanism that decomposes a reducing agent included in exhaust gas exhausted from a vacuum chamber. The decomposition mechanism has, in an exhaust passage connecting the vacuum chamber (10) and a vacuum pump (11), a flow path (16) having a catalytic layer (15), a bypass passage (12), and a gas introduction mechanism (13) that introduces oxygen or an oxygen-containing gas into the catalytic layer (15). In a method for decomposing the reducing agent, the exhaust gas exhausted from the vacuum chamber (10) is passed only through the catalytic layer (15) together with oxygen or oxygen-containing gas, thereby reducing the concentration of the reducing agent, after which the bypass passage (12) is opened and the interior of the vacuum chamber (10) is brought to vacuum, and the reducing agent undergoes decomposition in a second catalytic layer (7).