发明名称 |
ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE OBTAINED THEREFROM |
摘要 |
Object: To provide adhesive resin compositions improved in heat resistance without deteriorations in adhesive strength and flexibility. Solution: An adhesive resin composition comprises 30 to 98 wt% of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt% of a propylene resin composition (P) described below (wherein the total of the component (a) and the component (P) is 100 wt%). The propylene resin composition (P) comprises 60 to 0 wt% of a propylene polymer (b) having a melting point of 120 to 170°C and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt% of a propylene polymer (c) having a melting point of less than 120 °C or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min (wherein the total of the component (b) and the component (c) is 100 wt%). |
申请公布号 |
EP2666837(A4) |
申请公布日期 |
2015.05.06 |
申请号 |
EP20120736536 |
申请日期 |
2012.01.17 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
YASUI, HIROTO;MATSUNAGA, KOJI |
分类号 |
C09J123/08;C09J11/06;C09J11/08;C09J123/10;C09J123/14;C09J123/26;C09J131/04 |
主分类号 |
C09J123/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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