| 摘要 |
<p>There is provided a curable resin composition that exhibits high adhesive properties to materials such as glass, copper, aluminum, PET, and PC, which have been regarded as poor adherends relative to photo-curable compositions, and high adhesive properties also between adherends different from each other. A curable resin composition comprising a polyene compound of Formula (1):
(where n1, n2, and n3 are each independently an integer of 2 to 4; and R 1 to R 9 are each independently a hydrogen atom or a C mo alkyl group). The composition may further comprise a thiol compound or a photopolymerization initiator. The thiol compound may be a compound having two to six thiol groups in the molecule, or be an aliphatic thiol, or be produced by a reaction of an aliphatic mercapto carboxylic acid and a polyhydric alcohol. The polyhydric alcohol may be an aliphatic polyhydric alcohol or hydroxyalkyl isocyanurate.</p> |
