| 摘要 |
A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) comprises a resin composition which comprises (a) a styrene-based resin composition and (b) an ethylene-±-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50 mass%, and which has a Vicat softening temperature of 55 to 80 °C, while the heat seal layer (D) comprises an acrylic resin having a glass transition temperature of 55 to 80 °C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape. |
