| 摘要 |
An objective of the present invention is to improve surface uniformity for substrate processing. The substrate processing apparatus according to an embodiment of the present invention comprises a maintaining device, a plurality of nozzles, and a control unit. The maintaining device keeps a substrate rotatable. The plurality of nozzles are arranged on the maintaining device in a radial direction to supply a chemical solution to the substrate. The control unit supplies a chemical solution of a first temperature and a chemical solution of a second temperature higher than the first temperature in a prescribed ratio to each nozzle. In addition, the control unit supplies more chemical solution of the second temperature to a nozzle disposed closer to an outer circumference of the substrate than the chemical solution of the second temperature supplied to a nozzle disposed closer to the center of the substrate. And each nozzle supplies a mixed solution of the supplied chemical solution of the first temperature and the supplied chemical solution of the second temperature onto the substrate. |
