PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST

摘要

The present invention relates to a photocurable and thermocurable resin composition and dry film solder resist (DFSR), having fine protrusion on the surface without an additional treatment process such as plasma treatment process or the like, and enabling to form the low gloss surface of DFSR with excellent wiring concealing properties. The photocurable and thermocurable resin composition comprises: an acid modified oligomer containing a carboxyl group (-COOH) and a photocurable unsaturated functional group; poly acrylic acid; a photopolymerizable monomer containing at least two photocurable unsaturated functional groups; a thermocurable binder containing a thermocurable functional group; and a photoinitiator.