| 发明名称 |
Electronic device |
| 摘要 |
<p>The invention concerns an electronic device for dissipating heat generated from an electronic component including a heat dissipation tape affixed on a heat transfer path that receives transferred heat generated from the electronic component. The heat dissipation tape comprises at least one heat dissipation fin formed by folding back a portion of the heat dissipation tape.</p> |
| 申请公布号 |
EP2809134(A3) |
申请公布日期 |
2015.05.06 |
| 申请号 |
EP20140169446 |
申请日期 |
2014.05.22 |
| 申请人 |
FUNAI ELECTRIC CO., LTD. |
发明人 |
TAMAI, RYUICHI;ISHIDA, TOSHIYUKI |
| 分类号 |
H05K1/02;H01L23/367;H05K7/20 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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