发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 The present invention renders a proper tape processing unit mountable on a component supply unit, and mounts a proper electronic component on a substrate. A control unit 70 determines whether or not confirmation of the type of a tape processing unit 28 is necessary, and performs identification processing of the type of the tape processing unit 28 when confirmation of the type of the tape processing unit 28 is determined as necessary. Then, this identification processing of the type is performed and the control unit 70 determines whether or not an electronic component handleable by this tape processing unit 28 coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component D in a storage tape CX with an adsorption nozzle 7 when the electronic component is determined as coinciding.
申请公布号 EP2869682(A1) 申请公布日期 2015.05.06
申请号 EP20130808516 申请日期 2013.06.21
申请人 YAMAHA HATSUDOKI KABUSHIKI KAISHA 发明人 OHYAMA KAZUYOSHI;YANAGIDA TSUTOMU;KANO YOSHINORI;OHNISHI SEIJI;ONO TETSUJI
分类号 H05K13/02 主分类号 H05K13/02
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