发明名称 |
Circuit card assembly and method of fabricating the same |
摘要 |
A circuit card assembly (200) is provided. The circuit card assembly (200) includes a printed circuit board (202), at least one electronic component mounted on the printed circuit board (202), and a frame (210) coupled to the printed circuit board (202) such that the electronic component (244) is disposed between the printed circuit board (202) and the frame (210). The circuit card assembly (200) also includes a heat transfer device (266) coupled to the frame (210). The heat transfer device (206) has a heat pipe (224) disposed at least in part between the frame (210) and the printed circuit board (202). The circuit card assembly (200) further includes a pivotable brace (212) biasing the heat pipe (224) toward the electronic component (244) to facilitate cooling the electronic component (244). |
申请公布号 |
EP2869680(A1) |
申请公布日期 |
2015.05.06 |
申请号 |
EP20140190939 |
申请日期 |
2014.10.29 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
KIM, JOO HAN;DE BOCK, HENDRIK PIETER JACOBUS;LABHART, JAY TODD;CHAUHAN, SHAKTI SINGH;KIRK, GRAHAM CHARLES;CONNOLLY, STUART |
分类号 |
H05K7/14;H05K7/20 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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