METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

The present invention relates to a method for manufacturing a printed circuit board. A method for manufacturing a printed circuit board according to the present invention includes a step of preparing a substrate which includes a first insulating layer formed on a first circuit layer, a second insulating layer which cover a first circuit layer and the first insulating layer, a primer layer formed on the second insulating layer and a film layer formed on the primer layer, a step of hardening the primer layer, a step of removing the film layer, and a step of hardening the insulating layer.