发明名称 Stage apparatus and process apparatus
摘要 According to one embodiment, a stage apparatus includes a height control unit includes height control elements each which is drove in an upward/downward direction independently, a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas. The control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in a allowable range, and set the height of the area out of the allowable range again by the height control elements.
申请公布号 US9021983(B2) 申请公布日期 2015.05.05
申请号 US201213428530 申请日期 2012.03.23
申请人 Kabushiki Kaisha Toshiba 发明人 Inanami Ryoichi;Ito Shinichi;Koizumi Hiroshi;Kojima Akihiro
分类号 B05C11/00;C23C16/00;H01L21/76;H01L21/687;H01L21/67;H01L21/683 主分类号 B05C11/00
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
主权项 1. A process apparatus comprising: a height control unit provided under a lower surface of a substrate, the height control unit comprising height control elements each of which is driven in an upward/downward direction independently; a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas; a control unit which controls the height control unit and the measuring unit; and a material supplying unit which forms a functional material layer on the upper surface of the substrate, wherein the control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in an allowable range, and set the height of the area that is out of the allowable range again by the height control elements, and the control unit is configured to form the functional material layer on the upper surface of the substrate using the material supplying unit.
地址 Tokyo JP