发明名称 Inlet-air-cooling door assembly for an electronics rack
摘要 A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.
申请公布号 US9025331(B2) 申请公布日期 2015.05.05
申请号 US201213674217 申请日期 2012.11.12
申请人 International Business Machines Corporation 发明人 Campbell Levi A.;Chu Richard C.;David Milnes P.;Ellsworth, Jr. Michael J.;Schmidt Roger R.;Simons Robert E.;Zambrano Daniel E.
分类号 H05K7/20;F28D15/00;F28F9/00 主分类号 H05K7/20
代理机构 Heslin Rothenberg Farley & Mesiti P.C. 代理人 Chiu, Esq. Steven;Radigan, Esq. Kevin P.;Heslin Rothenberg Farley & Mesiti P.C.
主权项 1. A cooling apparatus comprising: a door assembly sized to couple to an electronics rack at an air inlet side of the electronics rack, the door assembly facilitating cooling of airflow into the electronics rack, and thereby, cooling of one or more electronic components of the electronics rack, and wherein the door assembly comprises: at least one airflow opening facilitating passage of airflow through the door assembly and into the electronics rack with the door assembly coupled to the electronics rack;at least one air-to-coolant heat exchanger disposed so that the airflow through the at least one airflow opening passes across the at least one air-to-coolant heat exchanger, the at least one air-to-coolant heat exchanger extracting heat from the airflow passing thereacross; andat least one airflow redistributor, the at least one airflow redistributor being part of the door assembly, and being distinct from and spaced from the at least one air-to-coolant heat exchanger, and being disposed within the door assembly in an airflow direction downstream of, and at least partially aligned to, the at least one air-to-coolant heat exchanger, wherein with the door assembly coupled to the electronics rack at the air inlet side thereof, the at least one airflow redistributor, at least partially, redistributes within the door assembly the airflow passing across the at least one air-to-coolant heat exchanger, before reaching the air inlet side of the electronics rack.
地址 Armonk NY US