Stacked electronic component and manufacturing method thereof

摘要

A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

主权项

1. A stacked electronic component, comprising:
a substrate having electrode portions; a first electronic component having first electrode pads connected to the electrode portions via first bonding wires, and adhered on the substrate via a first adhesive layer; a second electronic component adhered on the first electronic component via a second adhesive layer, the second adhesive layer containing an insulating filler maintaining a solid state at an adhesive temperature, the second electronic component having a protruding portion protruding outside from an outer periphery of the first electronic component and having second electrode pads arranged at an upper surface of the protruding portion, the second electrode pads being connected to the electrode portions via second bonding wires; and a sealing resin formed on the substrate to seal the first and second electronic components, the first and second adhesive layers, and the first and second bonding wires, wherein the second adhesive layer is made of an epoxy resin, and the insulating filler is made of at least one selected from the group consisting of an urethane resin, a polyimide resin, and an acrylic resin, wherein the second adhesive layer is softened or melted at the adhesive temperature at which the second electronic component is adhered, and the second adhesive layer containing the insulating filler is filled between a lower surface of the protruding portion and the substrate, and wherein the insulating filler is a spacer having a size keeping a distance between the first and second electronic components.