发明名称 Integrated electronic components and methods of formation thereof
摘要 Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
申请公布号 US9024417(B2) 申请公布日期 2015.05.05
申请号 US201313733565 申请日期 2013.01.03
申请人 Nuvotronics, LLC 发明人 Rollin Jean-Marc;Sherrer David W.
分类号 H01L29/40;H01L23/58;H01P3/06;H01P11/00;H05K1/02;H05K3/40;H05K3/46 主分类号 H01L29/40
代理机构 Dann Dorfman Herrell & Skillman, PC 代理人 Haun Niels;Dann Dorfman Herrell & Skillman, PC
主权项 1. An integrated electronic component, comprising: an electronic device; and a microstructure comprising a waveguide section having an outer conductor and an center conductor, the center conductor disposed within the outer conductor; and, one or more transition structures electrically coupling each of the center conductor and outer conductor of the waveguide section to the electronic device.
地址 Radford VA US