发明名称 |
Integrated electronic components and methods of formation thereof |
摘要 |
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. |
申请公布号 |
US9024417(B2) |
申请公布日期 |
2015.05.05 |
申请号 |
US201313733565 |
申请日期 |
2013.01.03 |
申请人 |
Nuvotronics, LLC |
发明人 |
Rollin Jean-Marc;Sherrer David W. |
分类号 |
H01L29/40;H01L23/58;H01P3/06;H01P11/00;H05K1/02;H05K3/40;H05K3/46 |
主分类号 |
H01L29/40 |
代理机构 |
Dann Dorfman Herrell & Skillman, PC |
代理人 |
Haun Niels;Dann Dorfman Herrell & Skillman, PC |
主权项 |
1. An integrated electronic component, comprising:
an electronic device; and a microstructure comprising a waveguide section having an outer conductor and an center conductor, the center conductor disposed within the outer conductor; and, one or more transition structures electrically coupling each of the center conductor and outer conductor of the waveguide section to the electronic device. |
地址 |
Radford VA US |