Imaging systems with circuit element in carrier wafer

摘要

An imaging system may include an image sensor package with an image sensor wafer mounted on a carrier wafer, which may be a silicon substrate. A capacitor may be formed in the carrier wafer. Trenches may be etched in a serpentine pattern in the silicon substrate. Conductive plates of the capacitor may be formed at least partially in the trenches. An insulator material may be formed between the capacitor and the silicon substrate. A dielectric layer may be formed between the conductive plates of the capacitor. The image sensor package may be mounted on a printed circuit board via a ball grid array. Conductive vias may electrically couple the capacitor and the image sensor wafer to the printed circuit board.

主权项

1. Apparatus, comprising:
a carrier wafer comprising a silicon substrate with a surface, wherein a trench is formed in the surface; an image sensor wafer having an array of image pixels, wherein the image sensor wafer is mounted on the carrier wafer; and a circuit element that is at least partially formed within the trench in the surface of the carrier wafer.