Package substrate processing method

摘要

A package substrate processing method of dividing a package substrate into a plurality of individual package devices along a plurality of division lines, the package substrate being composed of an electrode plate and a synthetic resin layer formed on the back side of the electrode plate for molding the package devices. The package substrate processing method includes an internal stress relieving step of cutting the electrode plate of the package substrate along a selected one of the division lines to form a relief groove, thereby relieving an internal stress in the package substrate, a resin layer planarizing step of grinding the synthetic resin layer of the package substrate to thereby planarize the synthetic resin layer, and a package substrate dividing step of dividing the package substrate held on a holding table under suction along the division lines.

主权项

1. A package substrate processing method of dividing a package substrate into a plurality of individual package devices along a plurality of crossing division lines, said package substrate processing method comprising:
forming an electrode plate extending over substantially an entire surface of said package substrate, said electrode plate having said division lines formed on a front side for partitioning a plurality of regions where said package devices are respectively provided and a synthetic resin layer formed on a back side of said electrode plate for molding said package devices, said package substrate processing method further comprising: an internal stress relieving step of cutting said electrode plate of said package substrate along a selected one of said division lines to form a relief groove, thereby relieving an internal stress in said package substrate; a resin layer planarizing step of grinding said synthetic resin layer of said package substrate after performing said internal stress relieving step, thereby planarizing said synthetic resin layer; a package substrate holding step of holding said synthetic resin layer of said package substrate on a holding table under suction after performing said resin layer planarizing step, said holding table having a plurality of crossing grooves respectively corresponding to said division lines and a plurality of suction holes respectively formed in a plurality of regions partitioned by said crossing grooves; and a package substrate dividing step of dividing said package substrate held on said holding table under suction along said division lines.