| 摘要 |
A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die. |
| 主权项 |
1. A solder reflow surface mount micro-electro-mechanical system (MEMS) microphone, the microphone comprising:
a lid having top and bottom surfaces and comprising at least one conductive layer and at least one non-conductive layer, wherein the conductive layer comprises the bottom surface of the lid, wherein the bottom surface has an attachment region and an interior region, the attachment region positioned between the interior region and the edges of the lid, and completely bounding the interior region; a sidewall spacer having top and bottom surfaces and comprising at least two conductive layers with a center layer of non-conductive material having a predefined thickness disposed between the two conductive layers, wherein one conductive layer comprises the top surface of the sidewall spacer and the other conductive layer comprises the bottom surface of the sidewall spacer, wherein the sidewall spacer further comprises an opening having walls covered with conductive material, and the opening walls extend through the center layer to the top surface and the bottom surface; a substrate comprising: a base layer comprised of at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region; a first plurality of metal pads disposed on the top surface of the base layer, wherein at least one pad of the first plurality of metal pads is located in the attachment region of the top surface of the base layer; a second plurality of metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within the edges of the base layer; one or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer, and wherein the at least one metal pad located in the attachment region of the top surface of the base layer is electrically coupled to one or more of the second plurality of metal pads; and an acoustic port disposed in the interior region of the base layer and passing completely through the base layer, wherein one of the second plurality of metal pads is a sealing ring that completely surrounds the acoustic port in the base layer; a MEMS microphone die mounted on the top surface of the base layer, and electrically coupled to at least one of the first plurality of metal pads on the top surface of the base layer, the MEMS microphone die being arranged directly over the acoustic port in the substrate; wherein the substrate, the sidewall spacer and the lid cooperate with each other to form a housing, wherein the edges of the substrate, the sidewall space, and the lid create side surfaces substantially perpendicular to the bottom surface of the substrate, and wherein the housing has an internal acoustic chamber for the MEMS microphone die; wherein the bottom surface of the sidewall spacer is coupled to the attachment region of the top surface of the substrate such that the opening of the sidewall spacer and the interior region of the top surface of the substrate are aligned, and the conductive material on the opening walls of the sidewall spacer is electrically coupled to the at least one metal pad located in the attachment region of the substrate; wherein the top surface of the sidewall spacer is coupled to the attachment region of the bottom surface of the lid such that the opening of the sidewall spacer and the interior region of the bottom surface of the lid are aligned, and the conductive layer of the lid is electrically coupled to the conductive material on the opening walls of the sidewall spacer; and wherein the interior region of the top surface of the substrate, the opening walls of the sidewall spacer, and the interior region of the bottom surface of the lid, when attached, define the acoustic chamber for the MEMS microphone die. |
