Semiconductor molding chamber

摘要

A system and method for a semiconductor molding chamber is disclosed. An embodiment comprises a top molding portion and a bottom molding portion that form a cavity between them into which a semiconductor wafer is placed. The semiconductor molding chamber has a first set of vacuum tubes which hold and fix the position of the semiconductor wafer and a second set of vacuum tubes which evacuate the cavity of extraneous ambient gasses. The encapsulant may then be placed over the semiconductor wafer in order to encapsulate the semiconductor wafer.

主权项

1. A method for encapsulating a semiconductor device, the method comprising:
providing a semiconductor device with a top surface and a bottom surface; positioning the bottom surface adjacent to a first mold portion comprising a separation component which separates a first pressure region adjacent to the bottom surface and a second pressure region adjacent to the top surface; reducing a pressure in the first pressure region along the bottom surface to affix the bottom surface to the first mold portion; positioning a second mold portion over the first mold portion and the semiconductor device, the second mold portion and the first mold portion defining a cavity enclosing the semiconductor device; evacuating gasses in the second pressure region adjacent to the top surface of the semiconductor device through a first vacuum hole; and applying an encapsulant to the top surface of the semiconductor device.